Job Description
Are you a visionary research engineer with a passion for pushing the boundaries of semiconductor manufacturing? The Agency for Science, Technology and Research (A*STAR), a leading force in Singapore's scientific innovation, is seeking a highly motivated and experienced Lead/Senior Research Engineer to join our Institute of Microelectronics (IME). This is an unparalleled opportunity to take charge of advanced bonding processes at our cutting-edge facility, contributing to the next generation of microelectronic devices.
As a key member of our team, you will be instrumental in pioneering advanced wafer bonding and die-to-wafer technologies crucial for 3D integration, advanced packaging, and heterogeneous integration. You will lead impactful R&D projects from conceptualization to implementation, collaborating with a multidisciplinary team of experts and industry partners. This role offers the chance to not only conduct groundbreaking research but also to develop and optimize critical processes that will shape the future of the global semiconductor industry. If you thrive in an environment of innovation, possess deep expertise in FAB processes and bonding technologies, and are eager to make a significant scientific and industrial impact, we invite you to explore this exciting opportunity in Singapore.
Join us at A*STAR IME, where your contributions will directly fuel technological advancements and cement Singapore's position as a global hub for high-tech innovation.
Responsibilities
- Lead and execute research and development projects focused on advanced wafer bonding, die-to-wafer, and other critical interconnection technologies for 3D integration and advanced packaging.
- Design, develop, and optimize FAB-level bonding processes, including process flow definition, equipment selection, and parameter optimization to achieve desired performance and reliability.
- Conduct in-depth characterization and failure analysis of bonded interfaces using advanced analytical techniques.
- Drive innovation in process control methodologies to ensure high yield, repeatability, and manufacturability of advanced bonding processes.
- Collaborate effectively with internal teams, academic partners, and industry stakeholders to translate research findings into practical applications and intellectual property.
- Mentor junior engineers and researchers, fostering a culture of technical excellence and continuous improvement.
- Prepare and present technical reports, publications, and presentations for internal reviews, conferences, and journals.
- Contribute to the strategic planning and roadmap development for future bonding technology research within IME.
Qualifications
- PhD or Master's degree in Electrical Engineering, Materials Science, Physics, Chemical Engineering, or a related discipline.
- Minimum of 5-8 years of relevant R&D experience in semiconductor manufacturing, with a strong focus on advanced bonding processes (e.g., hybrid bonding, Cu-Cu bonding, oxide bonding, thermal compression bonding).
- Proven expertise in FAB process development, optimization, and characterization techniques relevant to microelectronics.
- Demonstrated experience in leading research projects or technical teams from conception to successful completion.
- In-depth understanding of material properties, surface chemistry, and mechanical aspects related to wafer and die bonding.
- Proficiency with analytical tools and techniques such as SEM, TEM, FIB, AFM, XPS, FTIR for materials characterization and failure analysis.
- Strong problem-solving skills, excellent communication, and the ability to work collaboratively in a fast-paced research environment.
- A track record of scientific publications, patents, or successful technology transfer is highly desirable.