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Engineering 🏢 Full Time ⭐️ Verified

Engineer, Staff/Manager (Wet Bench / Electroplating)

RF360 Singapore
Kallang Way, Central Region, Singapore
Estimated Salary
SGD 8.000 – SGD 12.000
Posted Date
5 Mei 2026
Application Deadline
5 Mei 2027

Job Description

Join RF360 Singapore as a Staff/Manager Engineer specializing in Wet Bench and Electroplating processes, where you will drive yield and performance improvements in semiconductor manufacturing. You will lead a team of engineers and technicians, overseeing the development, optimization, and troubleshooting of wet etch and electroplating lines to ensure high-quality output and operational excellence. This role offers the opportunity to work with cutting‑edge equipment, implement data‑driven process improvements, and mentor junior staff while collaborating with cross‑functional teams to meet production targets.

Your expertise will be critical in maintaining process stability, reducing defects, and enhancing throughput. You will be responsible for designing experiments, analyzing data, and implementing corrective actions that directly impact product reliability and customer satisfaction. In addition, you will champion safety standards, continuous improvement initiatives, and knowledge sharing across the organization to foster a culture of excellence and innovation.

If you are passionate about semiconductor process engineering and enjoy leading technical teams in a fast‑paced environment, this position offers a rewarding career path with significant impact and opportunities for professional growth.

Responsibilities

  • Lead and manage the wet etch and electroplating process teams to achieve production and quality goals.
  • Develop, optimize, and troubleshoot wet bench and electroplating processes to improve yield and reduce defects.
  • Design and execute experiments (DOE) and statistical process control (SPC) studies to drive data‑based improvements.
  • Ensure compliance with safety, environmental, and regulatory standards in all wet processing operations.
  • Mentor and train engineers and technicians, fostering skill development and knowledge transfer.
  • Collaborate with equipment vendors and cross‑functional teams to evaluate new tools and technologies.
  • Prepare technical reports, presentations, and performance metrics for management review.

Qualifications

  • Bachelor’s or Master’s degree in Materials Science, Chemical Engineering, Electrical Engineering, or a related field.
  • Minimum 5‑8 years of experience in semiconductor wet processing, electroplating, or etch engineering.
  • Proven track record of process improvement, yield enhancement, and defect reduction in high‑volume manufacturing.
  • Strong knowledge of wet bench equipment, chemical formulations, and electroplating principles.
  • Experienced with statistical analysis, DOE, SPC, and root‑cause problem‑solving methodologies.
  • Excellent leadership, communication, and interpersonal skills with ability to mentor teams.
  • Familiarity with semiconductor fab safety protocols and environmental health & safety (EHS) standards.

Required Skills

Wet etch Electroplating Semiconductor process engineering Yield improvement Design of Experiments (DOE) Statistical Process Control (SPC) Team leadership Equipment troubleshooting Safety compliance Data analysis

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