Job Description
Join Efinix Technology (M) Sdn. Bhd., a leading semiconductor company, as an IC Assembly/Subcon Engineer in Bayan Lepas, Penang. You will act as the primary technical liaison between our design teams and outsourced semiconductor assembly and test (OSAT) partners. This role focuses on back-end packaging, assembly, and test processes to ensure high-quality packaged ICs for high-volume production.
You will collaborate with cross-functional teams across Design, Manufacturing, Quality, Reliability, and Supplier Management to optimize yield, reduce cycle time, and maintain robust change control. The position offers a unique opportunity to influence global supply chain performance and drive continuous improvement in a fast-paced, technology-driven environment in Penang, Malaysia.
Responsibilities
- Serve as the primary technical liaison between Efinix and OSAT partners for IC assembly, packaging, and test processes.
- Define and manage assembly/subcon requirements, test coverage, DFX/DFM considerations, and risk assessments for new products.
- Collaborate with Manufacturing, QA/Reliability, Packaging, and Design teams to ensure process maturity and timely product ramp.
- Drive supplier qualification, process characterization, and continuous improvement using DOE, SPC, and root-cause analysis of yield or defect issues.
- Review and approve process changes, ECOs, and documentation in line with change control and quality standards.
- Support NPI activities including process validation, qualification runs, and first-pass yield improvements with OSATs.
- Monitor KPIs such as yield, scrap, throughput, and on-time delivery; implement corrective actions as needed.
- Provide technical guidance during failure analysis and containment planning for assembly/test related issues.
Qualifications
- Bachelor's degree in Electrical Engineering, Materials Science, Physics, or a related field.
- 3+ years of experience in semiconductor back-end assembly, packaging, or OSAT environments.
- Solid knowledge of die attach, wire bonding, molding, encapsulation, testing, and related assembly processes.
- Experience with supplier management, QA/QC, process validation (DOE, SPC, FMEA), and documentation control.
- Strong analytical, problem-solving, and communication skills; ability to work cross-functionally in a matrix organization.
- Familiarity with IPC/JEDEC standards and reliability testing protocols.
- Project management or NPI experience with a track record of on-time delivery and risk mitigation.
- Willingness to travel to OSAT partners as required.