Job Description
Micron Semiconductors, a global leader in memory and storage solutions, is seeking a visionary Principal Engineer to lead our Front End Central Product Integration (FE cPIE) team in Singapore. In this critical role, you will drive cutting-edge innovation in High Bandwidth Memory (HBM) and advanced semiconductor products, ensuring seamless integration from design to high-volume manufacturing.
As a Principal Engineer, you will be the technical authority for front-end integration, collaborating with R&D, design, and operations to define process flows, optimize yield, and accelerate time-to-market. You will lead cross-functional teams to solve complex integration challenges and mentor a growing team of engineers.
Micron's Singapore facility is a center of excellence for memory R&D and manufacturing. We offer a dynamic environment where your contributions will have a direct impact on products that power AI, data centers, and mobile devices. We provide competitive compensation, comprehensive benefits, and opportunities for professional development.
If you are an experienced integration engineer with a passion for HBM and front-end technologies, we invite you to join our journey to transform the future of memory.
Responsibilities
- Lead the integration of front-end processes for new product introductions (NPI) of HBM and other advanced memory products.
- Define and optimize integration flow to ensure best-in-class yield, performance, and reliability.
- Collaborate with design teams to ensure product design compatibility with process capabilities.
- Drive root cause analysis and resolution of integration-related issues in a timely manner.
- Manage transfer of technology from R&D to manufacturing, ensuring smooth ramp.
- Mentor and guide junior engineers, fostering a culture of technical excellence.
- Interface with global cross-functional teams to align integration strategies and contribute to technology roadmap.
Qualifications
- PhD or Master's degree in Electrical Engineering, Materials Science, Physics, or related field.
- 10+ years of experience in semiconductor front-end process integration, with a focus on advanced memory technologies (e.g., DRAM, NAND, HBM).
- Proven experience leading cross-functional teams and managing complex integration projects.
- Deep knowledge of FEOL, BEOL, and emerging memory architectures.
- Strong understanding of design-process interactions and yield optimization techniques.
- Excellent problem-solving skills and ability to drive data-driven decisions.
- Effective communication and leadership skills, with a track record of mentoring.