Job Description
At the Agency for Science, Technology and Research (A*STAR), we are seeking a motivated Research Engineer (or Senior Research Engineer) to pioneer Physical Vapor Deposition (PVD) solutions for next‑generation advanced packaging. You will work in a multidisciplinary team developing thin‑film processes that enable higher performance, smaller form factors, and improved reliability for semiconductor devices. This role offers the opportunity to translate cutting‑edge research into manufacturable technologies while collaborating with industry partners and academic experts.
Your day‑to‑day activities will include designing and executing PVD experiments, analyzing film properties using techniques such as ellipsometry, X‑ray diffraction, and scanning electron microscopy, and optimizing process parameters for uniformity and adhesion. You will also contribute to technical reports, presentations, and patent disclosures, helping to shape A*STAR’s innovation pipeline.
If you have a strong background in vacuum deposition, materials characterization, and a passion for advancing packaging technologies, we invite you to join our vibrant research community in Singapore.
Responsibilities
- Design and conduct PVD deposition experiments for thin‑film layers used in advanced packaging.
- Characterize film thickness, composition, stress, and structural properties using ellipsometry, XRD, SEM, and AFM.
- Develop and optimize process recipes to achieve target film uniformity, adhesion, and electrical performance.
- Collaborate with cross‑functional teams to integrate PVD processes into packaging flow and assess reliability.
- Maintain detailed experimental documentation, prepare technical reports, and present findings at internal reviews.
- Support patent drafting and contribute to scientific publications that highlight A*STAR’s research impact.
Qualifications
- Bachelor’s or Master’s degree in Materials Science, Electrical Engineering, Physics, or a related field; PhD is a plus.
- Hands‑on experience with Physical Vapor Deposition (sputtering, evaporation, ALD) tools and processes.
- Strong background in thin‑film materials characterization and metrology techniques.
- Familiarity with semiconductor packaging concepts and advanced interconnect technologies.
- Proficient in data analysis using Python, MATLAB, or similar software; experience with statistical process control.
- Excellent communication skills, ability to work in a team, and a proactive problem‑solving mindset.