Job Description
Are you a passionate researcher or engineer looking to make a mark in the semiconductor and advanced packaging industry? The Institute of Microelectronics (IME) under the Agency for Science, Technology and Research (A*STAR) is currently seeking a highly motivated Research Engineer specializing in Temporary Bonding and Debonding (TBDB) processes. This is a unique opportunity to work at the forefront of semiconductor innovation in Singapore, contributing to the development of next-generation packaging solutions that drive global technological advancement.
In this role, you will be part of the Advanced Packaging and Manufacturing (APM) division, working alongside world-class scientists and industry partners. You will be responsible for pushing the boundaries of wafer-level packaging by developing robust, scalable, and innovative TBDB techniques. If you possess a strong background in materials science, lithography, or wafer bonding technologies, we invite you to help us solve complex engineering challenges that shape the future of electronics.
Responsibilities
- Design, execute, and optimize Temporary Bonding and Debonding (TBDB) process flows for 3D integrated circuit (IC) and advanced packaging applications.
- Conduct systematic characterization of bonded wafer interfaces, assessing mechanical integrity, void detection, and thermal stability.
- Collaborate with cross-functional teams to integrate TBDB processes into broader device fabrication flows.
- Analyze experimental data to troubleshoot process deviations and enhance process yield and reliability.
- Document technical findings, prepare comprehensive research reports, and present data to internal and industry stakeholders.
- Stay abreast of industry trends in 2.5D/3D packaging and emerging bonding materials.
- Maintain laboratory equipment and ensure compliance with all safety and cleanroom protocols.
Qualifications
- Bachelor’s or Master’s degree in Materials Science, Microelectronics, Electrical Engineering, or a related field.
- At least 2-4 years of hands-on experience in semiconductor cleanroom environments.
- Proficiency with TBDB equipment, wafer handlers, and metrology tools (e.g., Acoustic Microscopy, IR inspection, X-ray).
- Strong understanding of polymer chemistry, adhesive materials, and surface physics relevant to bonding.
- Demonstrated ability to design experiments (DOE) and utilize statistical analysis software.
- Excellent analytical, problem-solving, and communication skills in a collaborative R&D setting.
- Prior experience in advanced packaging or semiconductor manufacturing research is highly preferred.