Job Description
Join the Agency for Science, Technology and Research (A*STAR) at the forefront of semiconductor innovation. We are seeking a highly skilled Scientist specializing in Wafer-to-Wafer (W2W) bonding to join our Advanced Packaging and Manufacturing (APM) team. In this role, you will be instrumental in pushing the boundaries of 3D integration and chiplet-based packaging technologies.
As a key member of our R&D collective, you will develop, characterize, and optimize next-generation bonding processes essential for high-performance computing and AI hardware. You will work in a state-of-the-art cleanroom environment, collaborating with international research partners and industry leaders to translate novel concepts into scalable, industrial-grade manufacturing processes.
Responsibilities
- Design and execute experiments for advanced W2W bonding processes, including hybrid bonding and thermal compression.
- Characterize bonding interfaces using metrology tools such as SEM, TEM, and acoustic microscopy.
- Analyze process data to identify root causes of bonding defects and improve yield.
- Collaborate with cross-functional teams to integrate bonding processes into complex 3D chiplet architectures.
- Develop innovative process flows for thinning, temporary bonding, and die-to-wafer stacking.
- Document research findings and publish technical papers in top-tier semiconductor journals.
- Present research progress at international conferences and industry workshops.
Qualifications
- PhD or Master’s degree in Materials Science, Physics, Electrical Engineering, or a related discipline.
- Minimum 2-3 years of experience in semiconductor manufacturing or R&D, specifically in wafer bonding.
- Strong understanding of surface chemistry and thin-film deposition techniques.
- Proficiency in cleanroom protocols and semiconductor equipment operation.
- Excellent analytical skills and experience with statistical analysis software (e.g., JMP, Minitab).
- Proven ability to work effectively in a collaborative, multidisciplinary team.
- Strong project management skills and ability to meet tight R&D project deadlines.