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Senior High Bandwidth Memory (HBM) Electrical Failure Analysis (EFA) Engineer

Micron Semiconductors
Singapore
Estimated Salary
SGD 8.500 – SGD 14.000
Posted Date
4 Mei 2026
Application Deadline
4 Mei 2027

Job Description

Are you a seasoned expert in semiconductor failure analysis looking to shape the future of high-performance memory? Micron Semiconductors, a global leader in innovative memory and storage solutions, is seeking a Senior High Bandwidth Memory (HBM) Electrical Failure Analysis (EFA) Engineer to join our elite team in Singapore.

In this mission-critical role, you will be at the forefront of HBM technology development. You will leverage cutting-edge diagnostic tools and methodologies to identify, isolate, and characterize electrical failures in advanced memory architectures. Your work will directly influence product reliability, yield improvement, and the acceleration of next-generation AI and data center memory solutions. If you possess a deep understanding of DRAM architecture, an analytical mindset, and a passion for solving complex semiconductor challenges, we invite you to advance your career at the heart of the global memory industry.

Responsibilities

  • Perform comprehensive electrical failure analysis (EFA) on advanced HBM products to isolate root causes.
  • Utilize advanced diagnostic tools (e.g., ATE, logic analyzers, micro-probing) to trace and characterize failure modes.
  • Collaborate with cross-functional teams including design, process engineering, and manufacturing to drive yield enhancement.
  • Develop innovative methodologies and scripts to improve the speed and accuracy of the EFA process.
  • Document failure analysis findings in technical reports and present recommendations to key stakeholders.
  • Mentor junior engineers and provide technical leadership on EFA best practices.
  • Maintain and optimize lab equipment and diagnostic software environments.

Qualifications

  • Master’s or PhD degree in Electrical Engineering, Electronics Engineering, or a related field.
  • Minimum 5-7 years of professional experience in semiconductor failure analysis, specifically with DRAM or HBM memory.
  • Expertise in semiconductor device physics, digital logic, and memory architecture.
  • Proficiency in using sophisticated analytical instrumentation and software for data collection and signal analysis.
  • Strong problem-solving skills with a proven track record of resolving complex technical issues under tight deadlines.
  • Experience with data analysis tools and programming/scripting (e.g., Python, C++, or MATLAB) for automated data interpretation.
  • Excellent communication skills with the ability to articulate complex technical findings to diverse audiences.

Required Skills

HBM Electrical Failure Analysis EFA DRAM Semiconductor Physics ATE Testing Root Cause Analysis Yield Improvement Python Data Analysis

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