Job Description
About the Role
We are seeking a highly motivated and experienced Senior/Research Engineer to join our dynamic team specializing in PECVD (Plasma-Enhanced Chemical Vapor Deposition) processes for advanced packaging and photonics applications. In this pivotal role, you will be instrumental in optimizing PECVD processes, troubleshooting complex technical issues, and driving innovation in cutting-edge semiconductor technologies.
You will collaborate closely with cross-functional teams to develop and implement advanced deposition solutions that meet the stringent requirements of next-generation electronics and photonic devices. Your expertise will contribute to groundbreaking research that pushes the boundaries of what's possible in semiconductor manufacturing.
Key Responsibilities
- Optimize PECVD processes to achieve superior film quality, uniformity, and reliability for advanced packaging and photonics applications
- Troubleshoot and resolve complex technical issues related to PECVD equipment and processes
- Drive technical innovation by researching and implementing novel deposition techniques and materials
- Collaborate with multidisciplinary teams to develop processes for new product introductions
- Conduct detailed characterization and analysis of deposited films using various analytical techniques
- Document process parameters, experimental results, and technical procedures accurately
- Mentor junior team members and contribute to knowledge sharing within the organization
What You'll Bring
- Master's or PhD in Materials Science, Electrical Engineering, Physics, or a related discipline
- Proven experience (5+ years) in PECVD process development and optimization
- Strong understanding of semiconductor fabrication processes and thin film deposition techniques
- Experience with advanced packaging technologies such as TSV, flip-chip, or wafer-level packaging
- Proficiency in using characterization tools (SEM, AFM, XRD, ellipsometry)
- Excellent problem-solving and analytical skills
- Strong communication and presentation abilities
- Experience in photonics or RF devices is highly advantageous
Responsibilities
- Optimize PECVD processes to achieve superior film quality, uniformity, and reliability for advanced packaging and photonics applications
- Troubleshoot and resolve complex technical issues related to PECVD equipment and processes
- Drive technical innovation by researching and implementing novel deposition techniques and materials
- Collaborate with multidisciplinary teams to develop processes for new product introductions
- Conduct detailed characterization and analysis of deposited films using various analytical techniques
- Document process parameters, experimental results, and technical procedures accurately
- Mentor junior team members and contribute to knowledge sharing within the organization
Qualifications
- Master's or PhD in Materials Science, Electrical Engineering, Physics, or a related discipline
- Proven experience (5+ years) in PECVD process development and optimization
- Strong understanding of semiconductor fabrication processes and thin film deposition techniques
- Experience with advanced packaging technologies such as TSV, flip-chip, or wafer-level packaging
- Proficiency in using characterization tools (SEM, AFM, XRD, ellipsometry)
- Excellent problem-solving and analytical skills
- Strong communication and presentation abilities
- Experience in photonics or RF devices is highly advantageous