Home Job Details
M
Engineering 🏢 Full Time ⭐️ Verified

Senior/Staff Engineer, High Bandwidth Memory (HBM) Returned Material Authorization (RMA)

Micron Semiconductors
Singapore
Estimated Salary
SGD 9.000 – SGD 15.000
Posted Date
4 Mei 2026
Application Deadline
4 Mei 2027

Job Description

Are you ready to shape the future of memory technology? Micron Semiconductors is looking for a seasoned Senior or Staff Engineer to join our HBM (High Bandwidth Memory) Quality and Reliability team in Singapore. In this mission-critical role, you will be the technical authority for Returned Material Authorization (RMA) processes, ensuring that our next-generation memory products meet the highest standards of performance and reliability.

You will collaborate cross-functionally with Failure Analysis (FA), Product Engineering, and Supply Chain teams to drive root cause identification and preventive measures for HBM components. This is an exceptional opportunity for an expert to influence product quality loops and contribute to the evolution of AI and high-performance computing memory architectures.

Responsibilities

  • Lead the end-to-end RMA process for HBM products, ensuring efficient tracking and resolution.
  • Perform complex technical analysis of returned materials to identify failure modes and manufacturing defects.
  • Collaborate with global manufacturing and design teams to implement corrective and preventive actions (CAPA).
  • Drive communication with key stakeholders regarding RMA status, technical findings, and reliability trends.
  • Mentor junior engineers on advanced diagnostic techniques and quality engineering methodologies.
  • Develop and refine test scripts and analytical frameworks to accelerate RMA processing.
  • Represent the quality department in technical reviews for new HBM product iterations.

Qualifications

  • Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, or related field.
  • Minimum 5-8+ years of experience in semiconductor quality, reliability, or product engineering.
  • Deep understanding of HBM architectures, DRAM technology, and memory testing protocols.
  • Proficiency in failure analysis techniques (e.g., cross-sectioning, SEM, EDX, electrical characterization).
  • Strong knowledge of statistical process control and quality assurance standards (ISO, JEDEC).
  • Proven ability to manage technical projects in a fast-paced, high-volume manufacturing environment.
  • Excellent analytical, problem-solving, and communication skills in a global corporate setting.

Required Skills

HBM DRAM Semiconductor Quality RMA Failure Analysis Reliability Engineering Root Cause Analysis JEDEC Data Analysis Semiconductor Manufacturing

Ready to Take on This Challenge?

Make sure your resume is ready. Submit your application now before the deadline.

Apply Now

Related Jobs

Similar job recommendations for you

View All